toshiba original cmos 16-bit microcontroller tlcs-900/h series tmp95c061bfg TMP95C061BDFG semiconductor company
tmp95c061b i 2011-01-26 document change notification ? ? the purpose of this notification is to inform customers about the launch of the pb-free version of the device. the introduction of a pb-free replacement affects the datasheet. please understand that this notification is intended as a substitu te for a revision of the datasheet. changes to the datasheet may include the followin g, though not all of them may apply to this particular device. ? 1. part number example: tmpxxxxxxf tmpxxxxxxfg all references to the previous part number were left unchanged in body text. the new part number is indicated on the prelims pages (cover page and this notification). ? 2. package code and package dimensions example: lqfp100-p-1414-0.50c lqfp100-p-1414-0.50f all references to the previous package code and package dimensions were left unchanged in body text. the new ones are indicated on the prelims pages. ? 3. addition of notes on lead solderability now that the device is pb -free, notes on lead solderability have been added. ? 4. restrictions on product use the previous (obsolete) provision might be left unchanged on page 1 of body text. a new replacement is included on the next page. ? 5. publication date of the datasheet the publication date at the lower right corner of the prelims pages applies to the new device.
tmp95c061b ii 2011-01-26 1. part number 2. package code and dimensions previous part number (in body text) previous package code (in body text) new part number new package code tmp95c061bf p-qfp100-1414-0.50 tmp95c061bfg qfp100-p-1414-0.50 ? (note) ? (note) TMP95C061BDFG lqfp100-p-1414-0.50f note: pb-containing variant not available. * : for the dimensions of the new package, see the attached package dimensions diagram. 3. addition of notes on lead solderability the following solderability test is conducted on the new device. solderability test parameter test condition note use of sn-37pb solder bath solder bath temperature = 230 c, dipping time = 5 seconds the number of times = one, use of r-type flux solderability use of sn-3.0ag-0.5cu solder bath solder bath temperature = 245 c, dipping time = 5 seconds the number of times = one, use of r-type flux pass: solderability rate until forming 95% 4. restrictions on product use it replaces the ?restrictions on product use? on page 1 of body text. for details, see the attached restrictions on product use. 5. publication date of the datasheet the publication date of this datasheet is printed at the lower right corner of this notification.
tmp95c061b iii 2011-01-26 (annex) package dimensions qfp100-p-1414-0.50 unit : mm ?
tmp95c061b iv 2011-01-26 lqfp100-p-1414-0.50f unit: mm
tmp95c061b v 2011-01-26 restrictions on product use ? toshiba corporation, and its subsidiaries and affiliates (collectively ?toshiba?), re serve the right to make changes to the in formation in this document, and related hardware, software and systems (collectively ?product?) without notice. ? this document and any information herein may not be reproduc ed without prior written permission from toshiba. even with toshiba?s written permission, reproduc tion is permissible only if reproducti on is without alteration/omission. ? though toshiba works continually to improve product's quality and reliability, product can malfunction or fail. customers are responsible for complying with safety standards and for prov iding adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a ma lfunction or failure of product could cause loss of human life, b odily injury or damage to property, including data loss or corruption. before customers use the product, create designs including the product, or incorporate the product into their own applications, customers mu st also refer to and comply with (a) the latest versions of all relevant toshiba information, including without limitation, th is document, the specifications , the data sheets and application notes for product and the precautions and condi tions set forth in the "toshiba semiconductor reliability handbook" and (b) the instructio ns for the application with which the product will be used with or for. customers are solely responsible for all aspects of their own product design or applications, including but not lim ited to (a) determining the appropriateness of the use of this product in such des ign or applications; (b) evaluating and deter mining the applicability of any information c ontained in this document, or in charts, dia grams, programs, algorithms, sample application circuits, or any other referenced document s; and (c) validating all operating paramete rs for such designs and applications. toshiba assumes no liability for customers' product design or applications. ? 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